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Welcome to China Electronics Corporation
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Main Process     

In House at CEC          

Vendor Support

Assembly

Assembly

Sub-Assembly

Functional Testing

Hi-Pot testing

Packing

 

Sheet Metal

80 ton Press

10 to 250 ton Press

Laser Cutting, Press Brake

NCT – Numerical Control Turret

Welding

CO2 Robot Welding (MIG)

Argon Welding (TIG) /Spot Weld

Projection Weld

 

Machining

CNC Milling

Drilling/Taping/Spin Riveting/Staking

Grinding/Deburring/Cutting

CNC Milling

CNC Turning

Plating

IC Leadframe Plating

Copper Plating / Zinc Plating

E-Dip Plating / Powder Coating

Electro Nickel Plating

Electroless Nickel Plating

Aluminum Anodizing

Others

X-Ray Fluorescence (XRF)

Aluminum Extrusion

Tube Extrusion

Plastic Injection Mold

Die/Investing Casting

Powder Metal

Specialized Process

High-Pressure Water Jet

Sand Blaster